Bismuth-Based Alloys

Bismuth Alloys
Featuring 99.9% Bismuth and Low Melt Eutectic and Non-Eutectic Alloys offering custom compositions and forms
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Low Melting (Fusible) Alloys
Featuring 158°F, 203°F radiation shielding alloys, pipe bending alloys, and low temperature solders. Eutectic: melting points from 117° – 281°F.Non-eutectic: melting points from 107° – 338°F.Mellottes metal, Rose metal, Wood’s metal, and others. Low-melting alloy wire.
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Solders
Featuring: Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders
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Can be used for various soldering methods including Wave, Selective, and Hand. Known for best in class yields, this material outperforms all Sn/Cu based materials and delivers excellent performance across a wide range of Flux Technologies. SAC305 is used to stabilize the copper content in the wave solder bath depending on process conditions. Forms: - Regular Bar
- Shot
- Ingot
Belmont Product Code 7972 Nominal Composition: - Sn: 96.5%
- Ag: 3%
- Cu: 0.5%
Technical Info: - Solidus: 217 C (423 F)
- Liquidus: 220 C (428 F)
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Named after its inventor, Simon Quellen Field, Field's metal is Eutectic at 144 F, 62 C. Field's metal is expensive due to the price of indium, which makes up over half its mass. However, as it contains neither lead nor cadmium, it is a less toxic alternative to Wood's metal. It is used for die casting and rapid prototyping. Forms: - Approximately 2 lb Cakes
Belmont Product Code 2330 Nominal Composition: - Bi: 32.5%
- Sn: 16.5%
- In: 51%
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This Solder has good corrosion resistance and tensile strength. With a melting range beginning at 390 Deg. F. it avoids causing damage to critical electronics as well preventing substrate deformation and segregation. It is used very often in spray wire form for capacitors and other electronic parts. Forms: - 1/16" Dia. Plus .000" Minus .004" on 5 Lb. Spools
- 2-5 Ingot
- Cast Flat Anodes
Belmont Product Code 7601DS1C Nominal Composition: - 60.5% Sn
- 39.5% Zn
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Tin-Lead solders is the largest single group and the most widely used of the soldering alloys . Tin-Lead solders are compatible for use with all types of base metal cleaners, fluxes, and heating methods. 60/40 Tin Lead solder, almost the eutectic is particularly adaptable to delicate work or when soldering temperature may be critical. This particular item comes in 1/16" Diameter and can also be offered in other sizes as well. This is also a quick setting solder for fine electrical and tinsmith work. Forms: - 1/16" Dia. Solid Wire
Belmont Product Code 76001DSC Nominal Composition: - 60% Sn
- 40% Pb
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Lead Silver solders such as this have physical properties - tensile, creep, and shear strength - which are good to 350 Deg. F. Fatigue properties are also better than the non silver solder alloys. Forms: - .063 Dia. Solid Wire
- 5Lb. Spools
- Capping Bars
Belmont Product Code 5951DS1C Nominal Composition: - 60% Sn
- 40% Pb
- 5.5% Ag
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This is a Bismuth based non-eutectic alloy commonly used as a low-melting solder and also to make custom shaped blocks. It is also used to make metal inlays in wood and also useful for repairing antiques as the low melting temperature of Wood's metal makes it unlikely this will harm the original piece. Forms: - 1/4" Dia. Solid Wire
- 1/8" Dia Solid Wire
Belmont Product Code 2502DS1C Nominal Composition: - 12.5% Sn
- 25% Pb
- 50% Bi
- 12.5% Cd
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This is a Tin based non-eutectic low melting alloy . The principle uses of this alloy are in applications similar to investment casting in which it substitutes for the so called " lost wax " pattern dies. It's other applications also include proof casting and sealing or soldering in low-temperature applications. Forms: - Cakes
- Slug
Belmont Product Code 2405 Nominal Composition: - 40% Bi
- 60% Sn
Technical Info: - Melting Point - Solidus 281 F, 138 C
- Melting Point - Liquidus 338 F, 170 C
- Short-Term Tensile Strength lbs/sq.in. 8000
- Yield Temperature 302
- Weight lbs/cu.in 0.296
- Brinnell Hardness No. (500 kg) 22
- Growth/Shrinkage - Time after Casting: after 2 mi.: -0.0001
- after 1 hour: -0.0001
- after 24 hrs: -0.0001
- after 500 hrs: -0.0001
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This is a Bismuth based non-eutectic alloy used originally for making punch dies. It is now also used to make a wide variety of plates, chuck jaws and other holding devices for machine shops and manufacturing operations. Forms: - Cakes
Belmont Product Code 2481 Nominal Composition: - 48% Bi
- 28.5% Pb
- 14.5% Sn
- 9% Sb
Technical Info: - Melting Point - Solidus 218 F, 103 C
- Melting Point - Liquidus 440 F, 227 C
- Short-Term Tensile Strength lbs/sq.in. 13000
- Yield Temperature 240
- Weight lbs/cu.in 0.343
- Brinnell Hardness No. (500 kg) 19
- Growth/Shrinkage - Time after Casting: after 2 mi.: 0.0008
- after 1 hour: 0.0048
- after 24 hrs: 0.0051
- after 500 hrs: 0.0061
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This is Bismuth based non-eutectic alloy which does not contract upon cooling. It is mainly used as a solder but also as a heat transfer medium. Another application for this material is to serve as a valve element in automatic fire sprinklers. The valve, having a low melting point, melts in fire and provides water to stop the fire from spreading. Forms: - 2 lb Cakes Even Weight
- 1/8" x 18" Cast Strips
- 1/16", 1/32" Dia. Solid Wire
- Approx. 1/2" x 6" x 12" Broken Slabs
Belmont Product Code 2503 Nominal Composition: - 50% Bi
- 25% Pb
- 25% Sn
Technical Info: - Melting Point - Solidus 203 F, 95 C
- Melting Point - Liquidus 239 F, 115 C
- Short-Term Tensile Strength lbs/sq.in. 6200
- Yield Temperature 203
- Weight lbs/cu.in 0.3365
- Brinnell Hardness No. (500 kg) 9.5
- Growth/Shrinkage - Time after Casting: after 2 mi.: -0.0001
- after 1 hour: 0.0045
- after 24 hrs: 0.0052
- after 500 hrs: 0.006
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This is a Bismuth based eutectic alloy which finds uses in shielding during medical radiation treatments and is also a cadmium-free solution for radiation therapy. This material also has a rapid growth of up to .0061 after casting. It has also been used as anchoring material and for designing fusible links. Forms: - Cakes
- 1/8", 1/32" Dia. Solid Wire
- Irregular Shot
- Pigs
Belmont Product Code 2531 Nominal Composition: - 52.5% Bi
- 32% Pb
- 15.5% Sn
Technical Info: - Melting Point - Solidus 203 F, 95 C
- Melting Point - Liquidus 203 F, 95 C
- Short-Term Tensile Strength lbs/sq.in. 6100
- Yield Temperature 203
- Weight lbs/cu.in 0.35
- Brinnell Hardness No. (500 kg) 9
- Growth/Shrinkage - Time after Casting: after 2 mi.: -0.0002
- after 1 hour: 0.0055
- after 24 hrs: 0.0057
- after 500 hrs: 0.0061
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This is a Bismuth based non-eutectic alloy which has unique properties of shrinking immediately upon solidification and growing back to zero in 1 hour, followed by additional growth. This shrinkage-growth makes it an ideal alloy for proof casting and precision measurement of internal dimensions. Forms: - 2 lb Cakes
Belmont Product Code 2431 Nominal Composition: - 42.5% Bi
- 37.7% Pb
- 11.3% Sn
- 8.5% Cd
Technical Info: - Melting Point - Solidus 160 F, 71 C
- Melting Point - Liquidus 190 F, 88 C
- Short-Term Tensile Strength lbs/sq.in. 5400
- Yield Temperature 162.5
- Weight lbs/cu.in 0.341
- Brinnell Hardness No. (500 kg) 9
- Growth/Shrinkage - Time after Casting: after 2 mi.: -0.0004
- after 1 hour: 0
- after 24 hrs: 0.0022
- after 500 hrs: 0.0025